2005 IEEE INTERNATIONAL SOI CONFERENCE
Hyatt Regency Resort & Spa Hotel
Honolulu, Hawaii ¨ October 3 – 6, 2005
Download Call for Papers pg 1(.pdf) and 2 (.pdf)¨Submission Information
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Download MS Word Template ¨Committee¨Home
CALL FOR PAPERS
ABSTRACT SUBMISSION DEADLINE: MAY 6th, 2005
The IEEE Electron Devices Society will sponsor the 31st IEEE International SOI Conference October 4th to 6th 2005 at the Hyatt Regency Resort & Spa Hotel in Honolulu, Hawaii. The technical sessions will be preceded by a one-day Tutorial Short Course on October 3rd . The purpose of the Conference is to provide a forum for open discussion in all areas of silicon-on-insulator technologies and their applications. Rump sessions on Wednesday evening will encourage attendees to share their opinions and technical expertise on the chosen topics. A material and equipment exhibition relating to SOI technology will be held concurrently with the Conference. A Best Paper Award will be presented at the conclusion of the Conference.
Previously unpublished papers are solicited in all areas of SOI technology, including:
¨ SOI material science/modification, material characterization, and manufacture
¨ SOI device Physics and modeling
¨ SOI circuit applications (high-performance microprocessors, srams, asic, low power, high-voltage, rf, analog, Mixed mode, etc.)
¨ Double Gate/Vertical Channel Structures; Other Novel Structures
¨ New SOI structures, Circuits, and applications (3d integration, displays, microactuators- MEMS, microsensors, Novel Memories , OPTICS, etc.)
¨ SOI reliability issues (hot-carrier effects, radiation effects, high-temperature effects, etc.)
¨ Manufacturability and process integration of SOI devices and circuits
¨ Alternate silicon-on-insulator material (Strained SOI, etc.)
SUBMISSION INFORMATION
Prospective authors should prepare a 2-page summary of their work including illustrations that are suitable for reproduction in the Conference Proceedings (see instructions on back of this page). Indicate a preference for poster or oral presentation. Submissions will be accepted for review in PDF format only and should be e-mailed to . If the PDF requirement presents a problem, please contact the conference manager for assistance at or call (310) 305-7885 between the hours of 8:30 am and 4:30 pm Pacific Time.
SUMMARY PREPARATION
Preparation of Summary (Title-Initial Caps, 1 " from the top of the page)
J.P. Author and G.E. Coauthor (Author(s) - Initial Caps)
ACME Corp., First City, NY (Company, City, State, Country - Initial Caps)
This set of instructions is given in the style and format to be used by authors in preparing "camera-ready" summaries for the 2005 IEEE International SOI Conference. PLEASE DOWNLOAD MSWord Template. Please also download the IEEE pdf guidelines for additional information.
Criteria for Selection
Papers will be reviewed based on QUALITY, ORIGINALITY, and SIGNIFICANCE, and hence the summary should clearly reveal these attributes of the work described.
Size
The total length of the submitted summary including all text, graphs, tables, charts, drawings and pictures, is two pages. However, the authors of the accepted abstracts have the option (and are encouraged) to prepare and submit a three page long version of their accepted paper for publication in the conference proceedings. The summaries must be typed within the frame shown (2 columns of 3.16´´ wide and 0.17´´ spacing by 9´´ tall) which may be used as a template; the frame must not appear on the summary.
Margins are 1´´ from the top of the page to the Title, 1´´ from the bottom of the page, and 1´´ left and right margins, for 8.5´´x11´´ paper. The title shall be bold if possible, centered at the top of the page, and followed by the name(s) of the author(s) and their affiliation(s).
The font size/pitch used in the manuscript should be no smaller than 10 point/12 characters per inch. Tables, graphs and figures may be smaller if legible.
Pictures
Half-tone copies of black and white photographs are preferable for reproduction; however, if this is not possible, please understand that the reproduction quality may be degraded.
Cover Letter
Please submit an electronic copy of your summary with a cover letter identifying the contact author, mailing address, telephone number, fax number and e-mail address (if available). Also identify the presenting author, and indicate a preference for poster or oral presentation. This year, the conference will be accepting submissions ONLY in ELECTRONIC FORM, ONLY in PDF format. This may be emailed as an attachment to the conference manager at
Notification
Please submit your summary early, but no later than May 6, 2005. You will be notified by July 15, 2005 whether your paper is accepted for the Conference. If your paper is accepted, you will be requested to complete an IEEE copyright form. Please be sure to have sponsor approval if required. We will require the final abstracts in electronic form (PDF format) so the proceedings can be issued electronically. Details will be given in the acceptance letter. Like last year, authors prefering to use a laptop for their presentation are requested to submit their talk no later than one week before the conference to and .
Best Paper Award
The Best Paper Award will be awarded based on the summary submitted as well as the presentation at the Conference. Late News papers will not be eligible for the Best Paper Award.